Cheap imports are ratcheting up pressure on traditional carmakers, but changes are more difficult than anticipated.

The increasing adoption of AI in edge devices, coupled with a growing demand for new features, is forcing chipmakers to rethink when and where data gets processed, what kind of processors to use, and ...

Lithium batteries dominate today’s rechargeable battery market, and while they have been wildly successful, challenges with ...

Metrology and inspection are dealing with a slew of issues tied to 3D measurements, buried defects, and higher sensitivity as device features continue to shrink to 2nm and below. This is made even ...

A new technical paper titled “Ultra-low-crosstalk Silicon Switches Driven Thermally and Electrically” was published by ...

Cadence’s Satish Kumar C explores how the Deferrable Memory Write transaction type in PCIe and CXL can improve latency, ...

Some vehicles can have nearly 40 different harnesses to connect all the ICs. Like so much of the semiconductor industry, the automotive industry is now turning towards 3D-IC design techniques to help ...

A technical paper titled “Imaging hot photocarrier transfer across a semiconductor heterojunction with ultrafast electron ...

Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, which are more complex than in 2D IC designs. New materials used in 3D ICs ...

Network security protocols are the primary means of securing data in motion; that is, data communicated between closely connected physical devices or between devices and even virtual machines ...

Rollout of artificial intelligence has created a whole new set of challenges, along with a dizzying array of innovative options and tradeoffs.

A technical paper titled “Understanding surfaces and interfaces in nanocomposites of silicone and barium titanate through ...