Semiconductor Engineering

Thermal-Mechanical Optimization of 2.5D Flip-Chip Packages With Glass and Silicon Interposers (Univ. of Ottawa)

A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
Semiconductor Engineering

A Review Of Acoustic Side-Channel Attacks: An AI View (Penn State Univ.)

A new technical paper titled “A Survey on Acoustic Side-Channel Attacks: An Artificial Intelligence Perspective” was ...
Semiconductor Engineering

Thermal Scanning-Probe Lithography in vdW Heterostructures (TU Denmark)

A new technical paper titled “Gradient Electronic Landscapes in van der Waals Heterostructures” was published by researchers ...
Semiconductor Engineering

Research Bits: Jan. 6

Researchers from the Institute of Science Tokyo and Canon ANELVA Corporation built an ultrathin ferroelectric memory ...