The new USB Type-C Cable and Connector Specification Release 2.4 has reduced voltage detection thresholds (0.613V for 1.5A ...

A new high-performance microprocessor (MPU) in the RTOS-based RZ/A series from Renesas Electronics Corporation is designed to ...

Renesas’ RA2L2 ultra-low-power MCUs, with USB-C Rev. 2.4 support, target portable devices and PC peripherals. Renesas ...

Japanese chipmaker Renesas Electronics has scrapped its plan to mass-produce silicon carbide (SiC) power semiconductors, ...

Zaher, currently Vice President of the Timing Division within the Analog & Connectivity product group, joined Renesas in 2019 through the acquisition of Integrated Device Technology, Inc. He brings a ...

Renesas Electronics is reportedly exiting its silicon carbide (SiC) initiative, with Japanese media confirming the company ...

Seoul, South Korea, June 11, 2025 -- OPENEDGES Technology, a leading provider of memory subsystem IP solutions, today ...

TOKYO -- Japanese chipmaker Renesas Electronics has abandoned a plan to produce power semiconductors using a new material, retreating from an "early 2025" scheduled production launch at its plant in ...

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Reports of a likely bankruptcy filing by the US-based silicon carbide (SiC) wafer maker have been sending shockwaves through ...

Renesas Electronics has introduced the RA2L2 microcontroller (MCU) group with ultra-low power consumption and support for the ...

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the appointment of Zaher Baidas as Senior Vice President and General Manager of ...