Alphawave Semi, a developer of high-speed connectivity and compute silicon for technology infrastructure, has taped out one ...

GENESIS Project to develop more sustainable processes and technologies for the semiconductor-manufacturing industry.

GlobalFoundries to invest $16 billion to expand its semiconductor manufacturing and advanced packaging capabilities.

Softbank and Intel are developing a new large-capacity memory that will reduce power consumption compared to HBM.

Even after three years of mass production, Samsung is said to be struggling to raise 3nm yields above 50 per cent.

Combining optical and microwave signal processing on a single silicon chip the research groups have integrated high-speed ...

The first is the SM2504XT, an ultra-low power PCIe Gen5 DRAM-less controller offering industry-leading performance per watt, ...

Sarcina Technology has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO).

ST announces the start of mass-production for its ST67W611M1 combined Wi-Fi 6 and Bluetooth Low Energy 5.4 module.

Infineon announces collaboration with Typhoon HIL, a provider of Hardware-in-the-Loop (HIL) simulation solutions.

Blighter, a developer of electronic-scanning ground movement radars, has unveiled the B422LR border surveillance system.

Arm has announced Zena CSS, a standardised, pre-compute platform for the automotive sector that accelerates development.