AUSTIN, Texas — LSI Logic Corp. has developed a form of wire bond packaging that places the bonding pads directly on top of the active I/O circuitry on the silicon. The move could extend the reach and ...
Taiwan's top OSAT company ASE Technology Holding has been stepping up its purchases of more automated wire-bonding packaging machines to expand capacity for clients, while also enhancing its smart ...
In lieu of a conventional ion beam gun, the Bond Meister MWB-12-ST adopts a fast atom beam (FAB) gun to irradiate atoms for activating a material surface to bond. Whereas an ion gun radiates an argon ...
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