KYOTO, Japan, April 27, 2026--(BUSINESS WIRE)--Kyocera Corporation (President: Shiro Sakushima; "Kyocera") today announced that it is commercializing a new multilayer ceramic core substrate for ...
A new study shows that ultrafine-grained Ti-6Al-4V substrates refine the crystalline structure of high-entropy (TiZrVCrAl)N ...
The superior performance, functionality, and smaller form factors of 3D-ICs are propelling advances in the semiconductor industry. Unlike traditional 2D-ICs, 3D-ICs vertically stack multiple active ...
Samsung Electro-Mechanics is showcasing five next-generation semiconductor package substrates at KPCA Show 2026 in Incheon. The lineup includes 2.5D and 2.1D package substrates, glass substrates, ...
3D-printed polymers can create lightweight, complex parts with remarkable design freedom, but their surfaces often remain a weak link. Rough finishes, limited wear resistance, and poor adhesion to ...
A Samsung flag flutters outside the company's Seocho building in Seoul on May 20, 2026. Jung Yeon-je/AFP via Getty Images Shares of Samsung Electro-Mechanics crossed 2 million won intraday on Friday, ...
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