The use of memory-heavy IP in SoCs for automotive, artificial intelligence (AI), and processor applications is steadily increasing. However, these memory-heavy IP often have only a single access point ...
SUNNYVALE, Calif., May 21, 2008 – Denali Software, Inc., today, as one of the DDR PHY Interface (DFI) specification participating members including ARM, Denali, Intel, and Samsung, announced the ...
Memory systems have evolved a lot in the previous few years due to advancements in fabrication technology. High Bandwidth Memory (HBM) is an example of the latest kind of memory chips which can ...
In September, Rambus announced the achievement of reaching 4 gigabits per second (Gbps) operation with our HBM2E memory interface. This milestone was demonstrated in silicon and required mastering ...
PISCATAWAY, N.J.--(BUSINESS WIRE)--The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced a major update ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Continuing to lead the way forward for UFS technology, KIOXIA America, Inc. today announced sampling 1 of the industry’s first 2 Universal Flash Storage (UFS) 3 ...
Increased data usage in applications such as AI, ML, data center, networking and automotive systems is driving a need for higher bandwidth memory. The coming introduction of high-bandwidth 5G networks ...
Explosive growth of generative artificial intelligence (AI) applications in recent quarters has spurred demand for AI servers and skyrocketing demand for AI processors. Most of these processors — ...
UFS 5.0 is being developed to deliver significantly higher data rates by adopting MIPI M‑PHY 6.0 for the physical layer and UniPro 3.0 for the protocol. The new HS‑GEAR6 mode introduced in M‑PHY 6.0 ...
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