An electronic device is susceptible to Electrostatic Discharge (ESD) damage during its entire life cycle, including the phase from the completion of the silicon wafer processing to when the device ...
The new 224G PAM4 IP offering brings Credo’s high-performance, power-efficient SerDes technologies with fabrication on an industry-leading advanced process technology from TSMC to provide the ...
HSINCHU, Taiwan--(BUSINESS WIRE)--Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the availability of its 10G SerDes IP on UMC’s 22nm ...
Check out more coverage of DesignCon 2023. As the world deals with a deluge of data, everyone is trying to move it all faster from Point A to Point B—between chips on a circuit board, over backplanes, ...
Participation in Ecosystem Combines Arm’s World-Class Processing Capabilities with Credo’s Leading-Edge Connectivity IP to Enable Optimized Semiconductor Solutions “Credo’s leadership in high-speed ...
Mannheim, Germany -- EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, and Chip Interfaces, a leading supplier of digital IP cores are thrilled to offer the ...
Lattice announced the availability of the 40 Gbps SERDES Framer Interface, Level 5 (SFI5) Intellectual Property (IP) Core in the LatticeSC and LatticeSCM FPGA families. Lattice announced the ...
The relentless demand for massive amounts of data is accelerating the pace of high-performance computing (HPC) within the high-speed Ethernet realm. This escalation, in turn, intensified the ...
Credo expands its unique programmable power versus channel reach performance SerDes technology to TSMC N3 and N7/N6 processes SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd ...
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