Just picked up a used PIII Coppermine FCPGA. I have a HSF for this processor and so I went out to my local Radio Shack and picked up some heat sink compound. The directions say to use a "thin coat." ...
MATERIALS: Fujipoly’s SARCON SPG-30A is a newly developed high viscosity, thermal interface silicone compound that is designed to efficiently transfer heat from a board-level source to a heat sink or ...
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