Two new tools from KLA-Tencor—the SpectraShape 9000 optical critical-dimension metrology system and the BDR300 backside-defect inspection and review module—enable volume production of integrated ...
Overlay is one of the most critical process control steps of semiconductor manufacturing technology. A typical advanced scheme includes an overlay feedback loop based on after litho optical imaging ...
The impact of EUV resist thickness on 30nm via LCDU measured during after development inspection (ADI) and after etch inspection (AEI). October 21st, 2020 - By: Coventor This paper describes the ...
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