Advanced packaging is currently facing a critical challenge to increase manufacturing efficiency without sacrificing device performance. Vertical integration techniques, such as multi-tier die ...

Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause ...

AMD has been featured considerably in new leaks from Moore's Law is Dead, with Tom providing some more details on AMD's next-gen Instinct MI300 accelerator. The new AMD Instinct MI300 accelerator will ...

There's a rumored chip on the way from AMD with far more memory bandwidth than anything the company has shipped before. If the rumor is true, Milan-X will offer a mammoth amount of HBM bandwidth.

Nvidia has shared fresh details about its upcoming AI data‑center platform, Rosa Feynman, confirming that its next‑generation Feynman GPU architecture will use 3D die‑stacking technology and a custom ...