The Chiplet Summit has wrapped up and I’m still trying to catch up with all of the things I learned at the conference. We ...

The chiplets movement is gaining steam, and it’s apparent from how this multi-die silicon premise is dominating the program of the AI Hardware and Edge AI Summit to be held in San Jose, California ...

The move to multi-die integration brings both promise and complexity. Scalable interconnects and automation are emerging as ...

Chiplet PHY Designer 2025 from Keysight offers simulation capabilities for UCIe 2.0 and support for the Open Compute Project Bunch of Wires (BoW) standard. Tailored to AI and data center applications, ...

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA standards ...

As scaled-down circuits with limited functions redefine computing for AI, their flexibility requires a new approach to securing critical infrastructure.

The performance and packaging advantages of chiplets have been fairly well documented, but there’s been a lag in creating some of the standards and development platforms needed to move the technology ...

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which ...

New contributions to OCP include Foundation Chiplet System Architecture (FCSA) and BoW 2.0 for memory-intensive AI and HPC workloads SAN JOSE, Calif., Oct. 15, 2025 /PRNewswire/ -- Open Compute ...

Chiplets have emerged as a critical implementation paradigm for semiconductor products, primarily because they can deliver cost benefits relative to a non-chiplet-based approach. The first, most ...

One of the struggles of high core counts is communication between cores and outside the CPU. This problem is one that AMD has been grappling with since the launch of Zen. With up to 32 cores and now ...

Nvidia has "de-risked" creating GPUs from AMD Zen 2-style multiple chiplets, but its engineers say it's still not at a point where the technology makes sense in terms of dropping it into a next-gen ...