Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore, as artificial intelligence boosts demand for advanced memory chips.

Micron Technology (MU) is building a chip plant in Singapore, as part of an approximately $7 billion investment to meet artificial intelligence (AI) data center demand. The new HBM (high bandwidth memory) advanced packaging facility is a significant step for Singapore amid ongoing efforts to expand AI capacity across the globe.

Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.

It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new heights.

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor giant expands its capacity to cater to booming demand for AI chips.

Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) in Singapore. The company will invest $7 billion in the plant, as it expects demand for HBM3E,

Singapore is set to solidify its position in the global semiconductor supply chain with Micron Technology’s announcement of a $7 billion investment in a high-bandwidth memory (HBM) packaging facility.